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Laser Glass Cutting System

Laser Glass Cutting System

Mechanism of Cutting (for glass cutting)

Cutting that uses distortions caused by a temperature difference: no damage to the glass substrate.

The system increases the temperature of the glass substrate and then creates scribed lines via water-cooling. The depth of the scribed lines is approx. 120 μm (depending on the intensity of the laser light) in order to avoid scratching and cracking of the glass substrate.

Advantages of cutting systems using HardRam devices (for glass)

  • Their laser/mechanical systems have a good track record and provide stable performance.
  • Original advanced HardRam technology: a patented scribing method
  • Stable laser light intensity based on an original control method: (Laser Stability Control <2%)
  • No particles from scratching or cracking of the glass during the cutting process

  • Ultra Thin Glass Cutting
  • Crack-less Cutting(0.1t)
  • LCD Bonded Glass Cutting (0.2t x 2)

Comparison of mechanical cutting and laser cutting

  • Unlike diamond-wheel sawing, laser cutting does not involve mechanical contact with the surface of the glass substrate and causes no scratching and cracking of the cut surfaces.
  • Laser cutting also exhibits the same strength as other cutting methods in cutting hardened glass, and does not require cleaning and/or treatment of the cut surfaces after cutting (due to the absence of mechanical contact).

Mechanical cutting
(Diamond wheel sawing)
Laser cutting
Cut surface Contact-type teeth tend to cause micro-cracks and reduced glass strength. Good scribe depth of 120 μm
Grinding Required Not required
Strength Micro-cracks, brittle (mechanical strength) No micro-cracks, strong (mechanical strength)
Particles Particles attached to the diamond teeth can significantly degrade the quality of the glass. None

Electronic Device Manufacturing